Provide reliable intelligent equipment for semiconductor packaging and testing,Like has been practicing.
Taking the automatic IC carrier board balling machine as an example,98%of China’s market is monopolized by Singapore,South Korea and Japan.
Correspondingly,foreign automatic IC carrier board ball-mounting equipment has high price,poor localized service,slow response speed,and cannot be customized for the local market.It has become the current BGA packaging,GSP packaging,and SIP packaging companies that want to achieve intelligence.Production,the biggest pain point problem faced.
To achieve a breakthrough in domestic monopoly,it must master core technologies such as”high-precision machining and assembly,high-precision alignment,vacuum series equipment,and air pressure stability control”.
为半导体封测提供可靠的智能设备,立可一直在践行。
以全自动IC载板植球机为例,中国的98%市场,由新加坡、韩国、日本所垄断。
对应的,国外全自动IC载板植球机设备高价格、本土化服务差,响应速度慢、针对本土市场不能进行定制化开发,成为当前BGA封装、GSP封装、SIP封装企业想要实现智能化生产,所面临的最大痛点问题。
国产要实现垄断突破,就必须掌握“高精度加工及组装、高精密对位、真空系列设备、气压稳定控制”等核心技术。
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